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Microelectronics Packaging

Microelectronics Packaging
Linthicum Heights, Maryland 21240 - US

Job Description

Basic Qualifications:

  • 5+ years’ experience in microelectronics packaging design or related field (which may include technologies such as organic PWBs, multilayer ceramic packages, flip chip, 2.5D/3D packaging, MCM, QFN, IMA, etc)
  • Proficient with AutoCAD software
  • Proficient with design and routing of high density Printed Wiring Boards (PWBs)
  • Able to communicate and collaborate effectively as a member of an integrated product design team
  • Bachelor’s degree in mechanical engineering or related field
  • Must be a US Citizen, with ability to obtain a Secret clearance

Preferred Qualifications:

  • DOD Secret clearance or higher
  • 10+ years’ experience in microelectronics packaging design or related area
  • Proficient with Mentor Expedition software
  • Proficient with NX CAD software
  • Familiar with heat transfer methodologies for electronics, and thermal analysis tools
  • Familiar with manufacturing and test methodologies of microelectronics assemblies and PWBs
  • Master’s degree in mechanical engineering or related field

Contact:  Robert Godsey (201) 843-4400 ext. 2250

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